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SHENZHEN HYY TECHNOLOGY CO., LTD.

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Products: Copper Substrate , Aluminium Plate , Backlight Panels , Bulb Board , Copper Thickness Immersion Gold Board

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Profile by Routing LED PCB with Outdoor Lamp

$0.50 /piece


Stock:	1000piece

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Product Details

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Basic Info

Model NO.: hyy-007
Flame Retardant Properties: V0
Base Material: Aluminum
Processing Technology: Electrolytic Foil
Mechanical Rigid: Rigid
Brand: Hyy
Board Thickness: 1mm-10mm
Material Type: Totking T111
Specification: UL, SGS, ISO14001, ISO9001
HS Code: 85340090

Type: Rigid Circuit Board
Dielectric: Aluminum Base Board
Insulation Materials: Metal Composite Materials
Application: Consumer Electronics
Material: Aluminum
Special Prosess: Routing
Copper Thickness: 1 Oz-3oz
Trademark: HYY
Origin: Made in China

Product Description

Product Description:

Board material: EPA-M3
Board thickness:2.0 mm
Copper thickness:2oz
Thermal conductivity: 4.0W/MK
Withstanding voltage:2000V
Solder resist: White
Surface finishing: HASL
Special drill hole: NO

Certification: UL, ISO14001, ISO9001, SGS, TS16949
Used for high power led, electronics, machinery, industrial lighting and so on.
Good price and best price.

Factory Manufacture Capability
NO	ITEM	Techinical capabilities
1	Materials	FR-4, CEM-3, Al Base, Cooper Base.
2	Material Type	TOTKING T111, EASTPOWER EPA-M0
3	Layers	1 Layer
4	Min. core material	PP
5	Max. board size	600mm *1200mm
6	Copper Thickness	1-4 OZ
7	Min. board thickness	0.5 mm
8	Max. board thickness	5.0 mm
9	Min. line width/space	0.1mm
10	Min. Letter line width	0.15mm
11	Min. Letter height	0.8mm
12	Min. hole size	0.75mm(NPTH)
13	Hole dia. tolerance	±0.05mm
14	solder Mask	White, Black, Green
15	Outline Tolerance	±0.15mm
16	Modeling	Punching, Routing, V-cutting
17	Special Hole	Blind hole, Blind slot, T-hole, T-slot, Counter sink hole, Cup hole
18	Peel Strength	>=1.3N/mm
19	Thermal Stress	288ºC, 2min
20	Thermal Conductivity	>=2.0 W/m-k
21	Thermal Resistance	≤0.55 ºC/W
22	Test Voltage	5 V
23	Surface Finish	HAL , OSP , Immersion Gold
24	File Format	Gerber , DPF, HPGL,CAM,DXP,CADM,PADS
25	Dielectric Breakdown	>=2.5 KV
26	Max. Package Size	1200mm*600 mm

How to get a quote?( need provide us these information as below:)

Project		Surface Finish
Note		Stencil Manufacturing
Number of Layers		Stencil Material
Material		Stencil Thickness(um)
Material Thickness(mm)		Stencil Format
Copper Thickness(um)		PCB Dimensions(mm)
Solder Mask Color		Min Finished Hole Size(mm)
Silk Screen Color		Min Clearance(mm)
Milling		Min Track Width(mm)

Remarks:  please send gerber file with these formats: .PCB / .P-CAD / .DXP / .CAD / .Gerber

a) Base material: FR4/ AL/ FPC/ CEM-1/ CEM-3/ 94v0/ Rogers
b) Board thickness: 1.6mm-3.2mm/ 0.3mm-1.2mm
c) Copper thickness: Hoz/ 1oz/ 2oz/ 3oz/ 4oz, ect
d) Surface treatment: eg. Immersion gold/ OSP
e) color of solder mask and silkscreen: Green/White/Black/Red/Blue/Yellow
f) Quantity and board size

Delivery Timescales
Sample
*Single layer 4days
*Double Side 4-6days
*Aluminum PCB 7-10days
* Urgent Routing sample could be pushed 2-3 days earlier with premium.

Mass Production
*Single layer standard   10 days
*Double Side standard 12days
*Aluminum PCB standard 15days
*Material availability dependant.

Package & Shipping Method:
1. Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement

Payment method
1.     T/T
2.     Paypal
3.     Western Union

Primary Competitive Advantages:

Country of Origin
Green Product
Price
Product Performance
Quality Approvals
Service
Small Orders Accepted

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