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XIAMEN BOLION TECH. CO., LTD.

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Multilayer Flexible Printed Circuit Board

$1.66 /piece


Stock:	1000piece

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Product Details

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Basic Info

Model NO.: M6824A
Material: Polyimide
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Wearable
Flame Retardant Properties: V0
Base Material: Copper
Brand: FPC
Surface Treatment: Enig
Transport Package: Vacuum Package
Origin: China

Structure: Multilayer FPC
Combination Mode: Adhesive Flexible Plate
Conductive Adhesive: Conductive Silver Paste
Processing Technology: Electrolytic Foil
Insulation Materials: Organic Resin
Dimensions: 92.13 X 52.16mm
Trademark: BL
Specification: RoHs
HS Code: 85340090

Product Description

M6824A
Dimensions: 92.13 x 52.16mm
Line width/space: 0.16mm/0.16mm
Surface treatment: cold plating
Ni: 2 to 9um
Au: 0.05 to 1um
Outline tolerance: ±0.2mm
Cover layer tolerance: ±0.3mm
Minimum hole: 0.2mm
Minimum pitch: 0.2mm

Advantage:

1. Over 10 years' manufacturing experience
2. Assembly provided
3. 100% quality tested before shipment
4. Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
5. Our Products meet the RoHS & WEEE lead-free requirement.
6. Small Order accepted
7. 3 weeks for massive production; 10 days for sample since material prepared
Urgent case or spread delivery schedule will be updated per negociation then

FPC Apply:

medical apparatus
automobiles
aerospace
industrial equipment
detecting instruments
smart-home controller
consumer electronics, etc
Multilayer Flexible Printed Circuit Board

Main Technique Index
Description	Parameters
Description	Polyimide	Polyester
Base film Thickness (um)	12.5,25,35,50	12.5,25,35,50
Copper Thickness (um)	12,17.5,35,50,70,105
Min. Line Width/Line Space (mm)	0.075/0.075
Min. Hole Size (mm)	0.15
Tolerance (mm)	Outline:+/-0.05; Coverlay: +/-0.2
Peel Strength (kgf/cm)	Above 1.0	Above 0.8
Solder Resistance	260C 10 seconds	204C 5 seconds

Surface Treatment
Content	Normal coating thickness	Normal PNL size
Plating nickel gold (In house)	Ni:2-9um;Au:0.03-0.09um	300mm×400 MM
Plating hard gold (In house)	Ni:2-9um;Au:0.1-1.0um	300mm×400 MM
Plating soft gold (In house)	Ni:2-9um;Au:0.03-0.09um	300mm×400 MM
Plating pure tin (In house)	2.0-8.0um	300mm×400 MM
Immersion Tin (In house)	0.3-0.6um	300mm×400 MM
OSP (In house)	N/A	300mm×400 MM
ENIG (Hard Nickel) (In house)	Ni:2-6um;Au:0.03-0.10um	300mm×400 MM
ENIG (Soft Nickel) (In house)	Ni:2-6um;Au:0.03-0.10um	300mm×400 MM
ENEPIG (Hard Nickel) (In house)	Ni:2-6um;Au:0.03-0.10um	300mm×400 MM
HASL (Outsource)	Cover the pads with min thickness 1~2 um	300mm×400 MM
Immersion silver (Outsource)	Per standand creteria	300mm×400 MM