- Model NO.: M7941A
- Material: Polyimide
- Application: Digital Products
- Flame Retardant Properties: V0
- Base Material: Copper
- Dimensions: 81.36mm*75.73mm
- Trademark: Bolion
- Origin: China
- Structure: Multilayer FPC
- Combination Mode: Adhesive Flexible Plate
- Conductive Adhesive: Conductive Silver Paste
- Processing Technology: Electrolytic Foil
- Insulation Materials: Organic Resin
- Surface Treatment: Enig
- Specification: Multilayer
- HS Code: 85340090
M7941A
Dimension:81.36mm*75.73mm
Line Width/Space: 0.2mm/0.2mm
Base Material: 0.5oz Cu(RA), 1.0mil PI, 0.5oz Cu, 1mil PI,0.5oz Cu
Coverlayer: 1mil PI, 1mil ADH/ Green Oil
Stiffener: PI/FR4
Surface Treatment: ENIG: Au: 0.076-0.25um, Ni 2-5um
Line Width Tolerance: +/-0.05
Hole Tolerance: +/-0.076
Advantage:
1. Over 10 years' manufacturing experience
2. Assembly provided
3. 100% quality tested before shipment
4. Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
5. Our Products meet the RoHS & WEEE lead-free requirement.
6. Small Order accepted
7. 3 weeks for massive production; 10 days for sample since material prepared
Urgent case or spread delivery schedule will be updated per negociation then
FPC Apply:
medical apparatus
automobiles
aerospace
industrial equipment
detecting instruments
smart-home controller
consumer electronics, etc
| Main Technique Index | ||
| Description | Parameters | |
| Polyimide | Polyester | |
| Base film Thickness (um) | 12.5,25,35,50 | 12.5,25,35,50 |
| Copper Thickness (um) | 12,17.5,35,50,70,105 | |
| Min. Line Width/Line Space (mm) | 0.075/0.075 | |
| Min. Hole Size (mm) | 0.15 | |
| Tolerance (mm) | Outline:+/-0.05; Coverlay: +/-0.2 | |
| Peel Strength (kgf/cm) | Above 1.0 | Above 0.8 |
| Solder Resistance | 260C 10 seconds | 204C 5 seconds |
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| Surface Treatment | ||
| Content | Normal coating thickness | Normal PNL size |
| Plating nickel gold (In house) | Ni:2-9um;Au:0.03-0.09um | 300mm×400 MM |
| Plating hard gold (In house) | Ni:2-9um;Au:0.1-1.0um | 300mm×400 MM |
| Plating soft gold (In house) | Ni:2-9um;Au:0.03-0.09um | 300mm×400 MM |
| Plating pure tin (In house) | 2.0-8.0um | 300mm×400 MM |
| Immersion Tin (In house) | 0.3-0.6um | 300mm×400 MM |
| OSP (In house) | N/A | 300mm×400 MM |
| ENIG (Hard Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
| ENIG (Soft Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
| ENEPIG (Hard Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
| HASL (Outsource) | Cover the pads with min thickness 1~2 um | 300mm×400 MM |
| Immersion silver (Outsource) | Per standand creteria | 300mm×400 MM |
